FISCHER TECHNOLOGY INC.

FISCHERSCOPE X-RAY XDV-MUE SEMI

FISCHERSCOPE X-RAY XDV-MUE SEMI

Features

• Fully automated wafer handling and testing boost efficiency
• XRF system with excellent detector sensitivity and high resolution
• XRF system with polycapillary optics from the worldwide technology leader for measuring micro-spots 
• Accurately tests structures up to 10 µm in diameter
• Automatic pattern recognition pinpoints the positions to be measured
• Multiple operating modes; manual measurement possible whenever required
• Flexible: docking station for FOUP, SMIF and cassette, for 6", 8" and 12" wafers

Applications

Coating Thickness Measurement

• Base metallization layers (UBM) at the nanometer scale
• Thin lead-free solder caps on copper pillars
• Extremely small contact surfaces and other complex 2.5D / 3D packaging applications

Material Analysis

• C4 and smaller solder bumps

• Lead-free solder caps on copper pillars

The automated XRF system for inspecting wafer microstructures

Designed for quality control in the semiconductor industry, the FISCHERSCOPE® X-RAY XDV®-μ SEMI accurately measures microstructures on wafers – fully automatically. The whole automation unit is enclosed and therefore perfectly suited for use in clean rooms. FOUP and SMIF pods can be automatically docked to the measuring system. The handling and measurement inside the XDV-μ SEMI takes place entirely without manual intervention. Thanks to pattern recognition, the XRF gauge locates the specified measuring positions precisely and reliably. This automatic measuring process rules out damage and contamination caused by manual handling and ensures high throughput rates for inspecting valuable wafers.